制程能力Rigid RPCB Manufacturing Capability |
RPCB项目 Item | RPCB | HDI |
最小线宽/线距minimum linewidth/linespacing | 3MIL/3MIL(0.075MM) | 2MIL/2MIL(0.05MM) |
最小完成孔径（通孔）minimum hole diameter | 6MIL(0.15MM) | 6MIL(0.15MM) |
最小阻焊开窗（单边）minimum solder resist opening (single-side)
|
1.5MIL(0.0375MM) |
1.2MIL(0.03MM)
|
最小阻焊桥（IC）minimum solder resist bridge |
3MIL(0.075MM) |
2.2MIL(0.055MM) |
最大纵横比（板厚/孔径）maximum aspect Ratio (thickness/hole diameter)
|
10：1
|
8:1 |
阻抗控制精度 impedance control accuracy | +/-8% | +/-8% |
成品板厚范围 finished thickness | 0.3-3.2MM | 0.2-3.2MM |
最大生产板面积 maximum board size | 630MM*620MM | 620MM*544MM |
最大成品铜厚 maximum finished copper thickness
| 6OZ(210UM) | 2OZ(70UM) |
最小板厚（内层）minimum board thickness | 6MIL(0.15MM) | 3MIL（0.076MM） |
最大层数maximum layer | 14层 | 12层 |
表面处理Surface treatment |
HASL-LF、OSP 、Immersion Gold、 Immersion Tin 、Immersion Ag
|
Immersion Gold、OSP、selectiveimmersion gold、carbon print |
镭射最（小/大）孔径Min/max laser hole size | / | 3MIL(0.08MM)/9.8MIL(0.25MM) |
laser 孔孔径公差：laser hole size tolerance | / | 10% |
