R-F combines the benefits of both rigid and flexible boards. They occupy less space and provide enhanced reliability in signal transmission, aligning with the trend towards slimmer electronic devices.

刚柔结合R-F Series Products
Product Characteristics
  • HLC allows for a higher assembly density and resultsin a smaller overall size.
  • Facilitates easier routing of lines, leading to shorter pathsand improved data signal transmission speeds.
  • Primarily utilized in communications, aerospace,and medical sectors.
Product Application