Advanced Equipment
Nitrogen Oven
Max. Board Size (mm) ：600*600 Board Thickness(mm) ：0.20-6.0 Temperature Range(℃)：50~200
AVI
Max. Board Size (mm) ：50*50-240*400 Board Thickness(mm) ：0.30-8.0 Resolution(mm)：0.010
Backpack Drilling
Max. Board Size (mm) ：656*650 Board Thickness(mm)：≥ 0.6 Backpack Drilling Depth(mm)：0.2-4.0 Stub Length(mm) ：0.05-0.25
CCD Routing
Max. Board Size(mm)：560*712 Board Thickness(mm) ：0.1-4.5 Routing Tolerence(mm) ：±0.05
Internal Beveling
Max. Board Size(mm) ：320*480 Board Thickness(mm) ：1.0-3.2 Angle Range(°)：15°-45° Angle Accuracy(°)：±5°
External Beveling
Max. Board Size(mm)：360*450 Board Thickness(mm)：0.7-3.2 Angle Range(°)：15°-45° Angle Accuracy(°)：±5°
Gold Plating Line
Max. Board Size(mm)：622*723 Board Thickness(mm)：0.3-4.0 NI Thickness(µm) ：2-8 Gold Thickness(µm)：0.125-1.25
RTR Laser Drilling
Max. Board Size(mm)：550*630 Board Thickness(mm) ：0.030-0.20 Min. Through-Hole Dia.(mm)：0.030 Hole Pos. Accuracy(mm) :＜ 0.015
RTR Copper Plating
Max. Board Size(mm): 250* Material Length Board Thickness(mm) : 0.024-0.12 Copper Thickness Range(mm): ≤ 0.003 Max. Through-Hole Aspect Ratio : 1:4
Coverlay Laminating
Max. Board Size(mm) ：250*480 Board Thickness(mm) ：0.02-0.5 Alignment Accuracy(mm) ：±0.10 Position Accuracy(°) ：±5°
Character Printer
Max. Board Size(mm): 250*480 Board Thickness(mm)：0.024-3.2 Screen Printing Accuracy（mm)：±0.05 Min. Text Width & Height (mm) ：0.5*0.8
Automatic Stiffener
Max. Board Size (mm) ：260*430 Board Thickness (mm) ：0.05-0.5 Alignment Accuracy (mm) ：±0.05 Stiffener Size(mm) ：1.5*1.5-30*90
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