FPC
| Items | 2026 | 2027 | 2028 | ||
|---|---|---|---|---|---|
| Sample | MP | ||||
| Max. Layer Count | 8 | 8 | 8 | 10 | |
| Flexible Board Layer Count | 6 | 4 | 6 | 6 | |
| HDI Steps | 2 | 1 | 2 | 2 | |
| Drilling (mm) | Min. Mechanical Via | 0.075 | 0.100 | 0.075 | 0.075 |
| Min. Laser Through Via | 0.030 | 0.035 | 0.030 | 0.030 | |
| Min. Laser Blind Via | 0.065 | 0.075 | 0.065 | 0.065 | |
| Plating (μm) | Via Filling Dimple | ≤10 | ≤15 | ≤10 | ≤10 |
| Plating uniformity | 20% | 20% | 15% | 15% | |
| Trace Width/Space (μm) | Overall Copper Thickness <20μm | 35/40 | 40/40 | 35/35 | 35/35 |
| Overall Copper Thickness <25μm | 40/45 | 45/45 | 45/45 | 45/45 | |
| Overall Copper Thickness <30μm | 50/55 | 55/55 | 55/55 | 50/50 | |
| Overall Copper Thickness >30μm | 60/65 | 65/65 | 65/60 | 65/60 | |
| Goldfinger Width≤0.050 Tolerance(mm) | ±0.01 | ±0.015 | ±0.01 | ±0.01 | |
| Bonding Goldfinger Pitch Tolerance(mm) | ±0.025 | ±0.03 | ±0.025 | ±0.025 | |
| Covering Film Alignment Accuracy(mm) | ±0.15 | ±0.15 | ±0.125 | ±0.125 | |
| Solder Resistance Exposure Accuracy (mm) | ±0.040 | ±0.050 | ±0.040 | ±0.040 | |
| Contour Tolerance (150mm*150mm以内) | 0.08 | 0.100 | 0.080 | 0.080 | |
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