HDI
| Items | 2026 | 2027 | 2028 | |
|---|---|---|---|---|
| Sample | MP | |||
| Max. Layer Count (L) | 18 | 18 | 20 | 20 |
| Stack-Up | 1+N+1 ~ 6+N+6, Any layer | |||
| Finish Overall Board Thickness(mm) | 0.30-2.40 | 0.35-2.40 | 0.30-2.40 | 0.25-2.40 |
| Min. Trace Width/Space(mm) | 35/35 (mSAP) | 40/40 (Tenting) | 30/30 (mSAP) | 25/25 (mSAP) |
| Min Core Thickness(mm) | 0.040 | 0.050 | 0.040 | 0.035 |
| Min Prepreg Thickness(mm) | 30 | 40 | 20 | 20 |
| Min. Mechanical Via Diameter(mm) | 0.10 | 0.15 | 0.10 | 0.10 |
| Min. Laser Via Diameter(mm) | 0.065 | 0.075 | 0.060 | 0.050 |
| Max. Aspect Ratio (Through-hole) | 0.135 | 0.175 | 0.115 | 0.105 |
| Blind Vias Pad(mm) | 10:1 | 8:1 | 10:1 | 10:1 |
| Max. plating aspect ratio(Blind vias) | 1:1 | 0.8:1 | 1:1 | 1:1 |
| Via Filling Dimple (O/I) (mm) | 15/10 | 15/10 | 10/10 | 10/10 |
| Alignment of Soldermask Opening(mm) | ±20 | ±25 | ±20 | ±20 |
| Min. BGA (pitch)(mm) | 0.300 | 0.325 | 0.275 | 0.250 |
| Min. Soldermask Opening(mm) | 0.100 | 0.150 | 0.100 | 0.100 |
| Impedance Tolerance (Inner Layer) | ±8% | ±10% | ±7% | ±7% |
| Surface Finish | OSP, ENIG, OSP+ENIG, ENEPIG, Golden Finger | |||
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