HLC
| Items | 2026 | 2027 | 2028 | ||
|---|---|---|---|---|---|
| Sample | MP | ||||
| Max. Layer Count | 30 | 28 | 30 | 40 | |
| Max. Board Thickness(mm) | 670 x 580 | 620 x 580 | 620 x 580 | 670 x 580 | |
| Finish Overall Board Thickness(mm) | 0.3-4.0 | 0.4-3.8 | 0.3-4.0 | 0.3-6.0 | |
| Copper Thickness | Inner Layer | H oz-4 oz | H oz-4 oz | H oz-5 oz | H oz-5 oz |
| Outer Layer | 1/3 oz-5 oz | 1/3 oz-4 oz | 1/3 oz-5 oz | 1/3 oz-5 oz | |
| Min. Trace Width/Space | Inner Layer(mm) | 50/50 | 65/65 | 50/50 | 50/50 |
| Outer Layer(mm) | 65/65 | 75/75 | 65/65 | 65/65 | |
| Min. Mechanical Via Diameter(mm) | 0.150 | 0.150 | 0.125 | 0.100 | |
| Max. Aspect ratio | 20:1 | 16:1 | 20:1 | 20:1 | |
| Alignment of Soldermask Opening(mm) | ±0.025 | ±0.030 | ±0.025 | ±0.025 | |
| Layer to Layer Registration (mm) | ±0.114 | ±0.125 | ±0.114 | ±0.100 | |
| Back-drilling Stub Tolerance(mm) | 0.05-0.20 | 0.05-0.25 | 0.05-0.20 | 0.05-0.20 | |
| Impedance Tolerance | ±8% | ±10% | ±8% | ±7% | |
| Surface Finish | OSP, ENIG, Immersion Tin, Immersion Ag, Golden Finger | ||||
| Special Process | POFV, Segmented goldfinger, Step goldfinger, Depth control drilling, Mixed pressing | ||||
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