RFPC
Items | 2026 | 2027 | 2028 | |
Sample | MP | |||
| Max. Layer Count | 14 | 12 | 16 | 18 |
| Flex Layer Count | 6 | 4 | 8 | 8 |
| Stack-up Type | ～4+N+4 | ～3+N+3 | ～5+N+5/Any layer | |
| Minimum Flex Layer Thickness | 0.10mm | 0.12mm | 0.085mm | 0.085mm |
| Minimum FPC Coverlay Window | 3mm | 3.5mm | 2.7mm | 2.5mm |
| Line Width / Line Space (Flex Layer) | 0.055/0.055mm | 0.06/0.06mm | 0.055/0.050mm | 0.055/0.050mm |
| Minimum Mechanical Hole Diameter (Flex Layer) | 0.1mm | 0.15mm | 0.075mm | 0.075mm |
| Laser Via Diameter | 3mil | 3mil | 2mil | 2mil |
| Minimum Distance from Via Barrel to Rigid-Flex Edge (Single Point) | 0.7mm | 0.8mm | 0.6mm | 0.6mm |
| Adhesive Squeeze-out Control at Rigid-Flex Interface | 0.35mm | 0.4mm | 0.3mm | 0.25mm |
| Alignment Accuracy | 0.15mm | 0.10mm | 0.10mm | |
| Impedance Tolerance (Single-ended 50Ω / Differential 100Ω) | 10% | 8% | 8% | |
| Rigid Board Outline Dimension Tolerance (Edge-to-Edge) | ±0.1mm | ±0.075mm | ±0.075mm | |
| Flex Board Outline Dimension Tolerance (Edge-to-Edge) | 0.05mm | 0.05mm | 0.05mm | |
| Stiffener Types | SUS Stiffener，PI，FR4 | |||
| Key Technologies | Any layer / Asymmetric Structure / Airgap / POFV / Heavy Copper / GJB Standard Products | |||
| Surface Finishes | OSP ，ENIG，OSP+ENIG、ENEPIG、Golden Finger、HASL、 Immersion Tin | |||
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