High Density Interconnect / Interconnection
PCB is an essential component that physically supports and connects various electronic elements. It services as a conduit for electrical interconnection, offering benefits such as high density, reliability, customizable design, and flexibility in assembly and maintenance.
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Flexible Printed Circuit
FPC is a distinct type of PCB known for being lightweight, thin, and flexible. They are commonly used in devices such as mobile phones, laptops. computers, PDAs, digital cameras, and LCD screens.
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Rigid-Flexible Printed Circuit Board
R-F combines the benefits of both rigid and flexible boards. They occupy less space and provide enhanced reliability in signal transmission, aligning with the trend towards slimmer electronic devices.
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High Layer Count
The production method of multi-layer boards generally starts with the inner layer pattern being made first, and then the single-sided or double-sided substrate is made by printing and etching, and incorporated into the designated interlayer. Then, it is heated, pressed, and bonded. As for the subsequent drilling, it is the same as the plating through hole method of double-sided boards. Due to the demand for high functionality, large wiring capacity and excellent transmission characteristics have become the key demands of multilayer boards.
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