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Application: OLED Mobile Phone Structure: Double Layer Board Thickness: 0.128 mm Line Width/Space: 0.05 / 0.048 mm Min. Hole Diameter: 0.075 mm Surface Finish: Nickel-Silver Gold Process Characteristics: Yellow Covering Film, Green Oil, Steel Stiffiener, Adhesive tape,QR Code

Application: Intelligent Robot Structure: 4L R-F Thickness: FPC-0.12 mm Rigid Board-0.35 mm Line Width/Space: 0.080 / 0.060 mm Min. Hole Diameter: 0.2 mm Surface Finish: ENEPIG Process Characteristics: Yellow Covering Film, Black Oil, PI Stiffiener

Application: Automotive New Energy Battery Structure: Single Board Thickness: 0.16 mm Line Width/Space: 1.2 - 1.8 mm Length: 0.5 / 0.45 mm Min. Hole Diameter: NO Through Hole Surface Finish: ENEPIG Process Characteristics: Length1.843m, FR4, Stiffiener, Nickel Sheet, Adhesive Paper

Application: Medical Equipment Structure: Hollowed -Out Single Layer Thickness: 0.100 mm Hollow Finger Width: 0.176mm Surface Finish: Tin Plating Process Characteristics: Thin Fingers Hollowed Out On Both Sides, One Side of the Overhanging Design of the Three Areas of Copper Thickness Control Requirements of the Two Tin Thickness Control Requirements

Application: HW Smart Watch Structure: Double Layer Board Thickness: 0.100 mm Line Width/Space: 0.050 / 0.050 mm Min. Hole Diameter: Bilnd vias-0.07mm Through holes: 0.1mm Surface Finish: ENEPIG Process Characteristics: Yellow Covering Film, Black Oil,NFC and FPC are Welded

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, china

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