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HDI

Application：AI Accelerator Card Structure：18L Anylayer Thickness：62 mil Line width / Space：2.4 / 3.9 mil Min. Aperture：3.9 mil Laser Via Surface Treatment：Gold Plating Finger+ENIG Technological Feature：Any layer, X-Slot Via Design, Pressing 8 times, High alignment requirements

Application：NEA Control Domain Structure：10L HDI Thickness：71 mil Line width / Space：3.9 / 3.99 mil Min. Aperture：3.9 mil Laser Via Surface Treatment：ENIG Technological Feature：2+6+2, ASIL-D Safety Class Requirement / High Reliability / Fine Line / Complete Impedance Control

Application：Smart Phone Structure：14L HDI Thickness：30 mil Line width / Space：1.6 / 2.0 mil Min. Aperture：3.0 mil Laser Via Surface Treatment：ENIG+OSP Technological Feature：Any layer, X-Slot Via Design, 1017 Thin Prepreg

Application：Mini LED (P0.58) Structure：10L HDI Thickness：47 mil Line width / Space：2.0 / 2.0 mil Min. Aperture：3.0 mil Laser Via Surface Treatment：ENIG Technological Feature：2+6+2, 4mil PAD gap 2.4mil

Application：Camera Module Structure：12L HDI Thickness：55 mil Line width / Space：3.0 / 3.0 mil Min. Aperture：3.0 mil Laser Via Surface Treatment：ENIG Technological Feature：8-stage Blind & Buried Hole, Pressing 9 times(8+4+8 Stack-up), Copper Paste Plugged Via

Application：77G Millimeter Wave Radar Structure：8L HDI Thickness：63 mil Line width / Space：3.5 / 5.9 mil Min. Aperture：5.9 mil Laser Via Surface Treatment：OSP Technological Feature：Line width tolerance ±0.6mil, Antennqa EA≤0.6mil, with copper step depth control Copper thickness in antenna area is 1±0.2mil and other areas is 1.8±0.2mil

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, China

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