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HDI

Application: Millimeter Wave Radar Structure: 8L HDI Thickness: 1.6 mm Line Width/Space: 0.090/0.15mm Min. Hole Diameter: 0.15 mm Laser Via Surface Finish: OSP Process Characteristics: 1step(un-symmetric),Antenna trace width tolerance±15μm，EA≤15μm； Stepped copper, copper thickness 25±5μm in antenna area, 45±5μm in other areas

Application: Mini LED (P0.58) Structure: 10L HDI Thickness: 1.2 mm Line Width/Space: 0.050 / 0.050 mm Min. Hole Diameter: 0.076 mm Laser Via Surface Finish: ENIG Process Characteristics: 2+6+2，0.1mm PAD gap 60μm

Application: NEA Control Domain Structure: 10L HDI Thickness: 1.8 mm Line Width/Space: 0.100 / 0.100 mm Min. Hole Diameter: 0.10 mm Laser Via Surface Finish: ENIG Process Characteristics:2+6+2, ASIL-D Safety Class Requirement / High Reliability / Fine Line / Complete Inpedance Cont

Application: Smart Phone Structure: 14L HDI Thickness: 0.75mm Line Width/Space:0.040 / 0.050 mm Min. Hole Diameter: 0.076 mm Laser Via Surface Finish: ENIG+OSP Process Characteristics:Anylayer，X-hole design.1017 Thin PP

Application: AI Accelerator Card Structure: 18L HDI Thickness: 1.57mm Line Width/Space: 0.060 / 0.100 mm Min. Hole Diameter:0.10 mm Laser Via Surface Finish: Gold plating finger+OSP Process Characteristics: Anylayer， X-hole design ，8times laminations，strict layer alignment

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, china

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