MLB & HLC-Products-Huizhou CEE Technology lnc-R&D to sales and manufacturing

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MLB & HLC

Application：Switch (400G) Structure：28L MLB Thickness：146 mil Line width / Space：3.9 / 3.9 mil Min. Aperture：15.7 mil Via Surface Treatment：Gold Technological Feature：IT-988GSE, Back Drilling, POFV

Application：Switch Structure： 20L MLB Thickness： 102 mil Line width / Space： 3.5 / 4.0 mil Min. Aperture： 9.8 mil Via Surface Treatment： OSP Technological Feature：Resin Plug Hole, POFV, N+N Stack-up

Application：Supercomputer Server Structure： 24L MLB Thickness： 118 mil Line width / Space： 2.9 / 3.0 mil Min. Aperture： 7.9 mil Via Surface Treatment： ENIG Technological Feature：Resin Plug Hole, POFV, Twice Pressing, Blind and Buried Via

Application：HPC Structure： 18L MLB Thickness： 98 mil Line width / Space： 3.4 / 3.5 mil Min. Aperture： 7.9 mil Via Surface Treatment： OSP Technological Feature：TU883, Back drilling, POFV

Application：Server Structure： 20L MLB Thickness： 94 mil Line width / Space： 3.7 / 4.0 mil Min. Aperture： 7.9 mil Via Surface Treatment： ENIG Technological Feature：Back drilling, POFV

Application：GPU Riser Card Structure： 18L Anylayer Thickness： 86.6 mil Line width / Space： 3.5 / 3.0 mil Min. Aperture： 7.9 mil Via Surface Treatment： ENIG+GF Technological Feature：Segmented Golden Finger, Back drilling, Resin Plug Hole, POFV

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, China

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