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MLB & HLC

Resin-plug vias,POFV,2 times pressing with blind & buried vias

Application: Switch Structure: 28L PCB Thickness: 3.7 mm Line Width/Space: 0.100 / 0.100 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG Process Characteristics:IT-988GSE, Back Drilling+POFV

Application: Server Structure: 20L PCB Thickness: 2.4mm Line Width/Space: 0.100 / 0.100 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG Process Characteristics: Back-drilling,POFV

Application:HPC Structure: 18L PCB Thickness: 2.5mm Line Width/Space:0.086 / 0.089 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG Process Characteristics: TU883 Back-drilling,POFV

Application: GPU Accelerator Card Structure: 16L PCB Thickness: 2.2 mm Line Width/Space: 0.089 / 0.076 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG+Goldfinger Process Characteristics: Steps Goldfingers,Back-drilling,POFV,Resin-plug vias

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, china

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