Advanced Equipment
Vacuum Press
Max. Board Size (mm)：1200*700 Board Thickness(mm)：0.05-10.00 Max. Temperature(℃)：250 Max. Pressure(PSI)：500
Laser Drilling
Max. Board Size(mm)：550*630 Board Thickness(mm)：0.05-5.00 Min. Micro Via Hole Diameter(mm)：0.065 Hole Position Accuracy (mm)：＜ 0.015
Mechanical Drilling
Max. Board Size (mm)：556*650 Board Thickness(mm)：0.05-5.00 Drill Hole Size(mm)： 0.15-6.50 Hole Position Accuracy(mm)： ± 0.05
Horizontal PTH Line
Max. Board Size (mm)：610*623 Board Thickness(mm)： 0.05-2.40 Min. Micro Via Hole Diameter (mm)：0.05 Max. Micro Via AR：1:1
Plasma
Max. Board Size (mm) ：660*1118 Board Thickness(mm) ：0.05-6.30 Min. Micro Via Hole Diameter (mm)：0.05 Max. Through-hole AR ：40:1
Via Filling VCP Line
Max. Board Size (mm) ：630*650 Board Thickness(mm)：0.05-2.40 Copper Thickness R Value (mm)： ≤ 0.005 Max. Micro Via AR：1:1
Horizontal Via Filling Line
Max. Board Size (mm) ：610*623 Board Thickness(mm)：0.05-2.40 Copper Thickness R Value(mm)： ≤ 0.005 Max. Micro Via AR：1:1
Pulse VCP Line
Max. Board Size(mm) ：622*546 Board Thickness(mm)：0.05-4.00 Copper Thickness R Value (mm)： ≤ 0.010 Max. Through-hole AR：20:1
Resin Grinding Line
Max. Board Size (mm) ：610*623 Board Thickness(mm) ：0.20-3.20 Min. Hole size(mm)：0.15
LDI Exposure
Max. Board Size(mm): 660*660 Board Thickness(mm): 0.05-8.00 Resolution(mm): 0.015 Registration(mm): ±0.010
S/M DI Exposure
Max. Board Size (mm) ：635*813 Board Thickness(mm)：0.15-3.20 Min. SRO(mm)：0.08 Registration(mm) ：±0.05
Vacuum Etching
Max. Board Size (mm)：554*640 Board Thickness(mm)： 0.05-2.40 Etching Factor：≥4 Etching Uniformity：≥90%
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