HDI

Application：Smart Phone Structure：14L HDI Thickness：30 mil Line width / Space：1.6 / 2.0 mil Min. Aperture：3.0 mil Laser Via Surface Treatment：ENIG+OSP Technological Feature：Any layer, X-Slot Via Design, 1017 Thin Prepreg

Application：Smart Phone

Structure：14L HDI

Thickness：30 mil

Line width / Space：1.6 / 2.0 mil

Min. Aperture：3.0 mil Laser Via

Surface Treatment：ENIG+OSP

Technological Feature：Any layer, X-Slot Via Design, 1017 Thin Prepreg

Category: HDI

Product Inquiries:

+86-752-5703333

Product Inquiry

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, China

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