HDI

Application：Camera Module Structure：12L HDI Thickness：55 mil Line width / Space：3.0 / 3.0 mil Min. Aperture：3.0 mil Laser Via Surface Treatment：ENIG Technological Feature：8-stage Blind & Buried Hole, Pressing 9 times(8+4+8 Stack-up), Copper Paste Plugged Via

Application：Camera Module

Structure：12L HDI

Thickness：55 mil

Line width / Space：3.0 / 3.0 mil

Min. Aperture：3.0 mil Laser Via

Surface Treatment：ENIG

Technological Feature：8-stage Blind & Buried Hole, Pressing 9 times(8+4+8 Stack-up), Copper Paste Plugged Via

Category: HDI

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+86-752-5703333

Product Inquiry

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, China

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