MLB & HLC

Application：HPC Structure： 18L MLB Thickness： 98 mil Line width / Space： 3.4 / 3.5 mil Min. Aperture： 7.9 mil Via Surface Treatment： OSP Technological Feature：TU883, Back drilling, POFV

Application：HPC
Structure： 18L MLB
Thickness： 98 mil
Line width / Space： 3.4 / 3.5 mil
Min. Aperture： 7.9 mil Via
Surface Treatment： OSP
Technological Feature：TU883, Back drilling, POFV

Category: MLB & HLC

Product Inquiries:

+86-752-5703333

Product Inquiry

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, China

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