Technology Roadmap
HLC HDI FPC

 

Max. Layer Count

2024

2025

2026

Sample

 

Max. Layer Count

30

28

42

50

Max. Board Size(mm)

670x580

620x580

860x600

1100x580

Overall Board Thickness(mm)

0.3-5.0

0.4-4.0

0.3-8

0.3-10

Maxed Cu Thickness

Inner Layer

HOZ-6OZ

HOZ-4OZ

HOZ-6OZ

HOZ-6OZ

Outer Layer

1/3OZ-6OZ

1/3OZ-4OZ

1/3OZ-12OZ

1/3OZ-12OZ

Min. Trace Width/Space(mm)

Inner Layer

0.050/0.050

0.065/0.065

0.050/0.050

0.050/0.050

Outer Layer

0.065/0.065

0.075/0.075

0.065/0.065

0.065/0.065

Min. Via Hole Diameter

0.15

0.15

0.1

0.1

Max. Aspectratio

0.834027778

0.667361111

1.042361111

1.250694444

Min. S/M Registration(mm)

±0.020

±0.030

±0.015

±0.015

Min. S/M Web(mm)

0.05

0.065

0.05

0.05

Layerto Layer Registration(mm)

±0.114

±0.125

±0.100

±0.100

Min. Back-drilled Stublength(mm)

0.05-0.20

0.05-0.25

0.05-0.20

0.05-0.18

Impedance Tolerance

±8%

±10%

±7%

±7%

Surface Finish

HASL-LF、OSP、ENIG、ImmersionTin、ImmersionAg、GoldenFinger

Special Process

POFV,  Depth Control Routing, Depth Control Drilling, Segmented Golden finger, Hybrid Pressing