Series Classification
Application：HW Smart Watch Structure：Double Layer Board Thickness：3.9 mil Line width / Space：2.0 / 2.0 mil Min. Aperture：Bilnd Via 3.0 mil, PTH 3.9 mil Surface Treatment：Nickel-Silver Gold Technological Feature：Yellow Covering Film, Black Ink, NFC and FPC are Welded
Application：Automotive Ridar Structure：Double Layer Board Thickness：3.9 ± 1.2 mil Line width / Space：2.4 / 2.4 mil Min. Aperture：1.2 mil Surface Treatment：Nickel-Silver Gold Technological Feature：Microvia filling for BGA pads, 30μm via diameter (Dimple depth <10μm)
Application：Automotive New Energy Battery Structure：Single Layer Board Thickness：6.3 mil Product Length：1.2 - 1.8 m Line width / Space：19.7 / 17.7 mil Min. Aperture：Non Through Hole Surface Treatment：Nickel-Silver Gold Technological Feature：Yellow Covering Film, FR4 Stiffener, Nickel Sheet, Tape
Application：Medical Equipment Structure：Hollowed -Out Single Layer Thickness：3.9 mil Hollow Finger Width：6.9 mil Surface Treatment：Tin Plating Technological Feature：Thin Fingers Hollowed Out On Both Sides, One Side of the Overhanging Design of the Three Areas of Copper Thickness Control Requirements of the Two Tin Thickness Control Requirements
Application：NEA Control Domain Structure：10L HDI Thickness：71 mil Line width / Space：3.9 / 3.99 mil Min. Aperture：3.9 mil Laser Via Surface Treatment：ENIG Technological Feature：2+6+2, ASIL-D Safety Class Requirement / High Reliability / Fine Line / Complete Impedance Control
Application：Smart Phone Structure：14L HDI Thickness：30 mil Line width / Space：1.6 / 2.0 mil Min. Aperture：3.0 mil Laser Via Surface Treatment：ENIG+OSP Technological Feature：Any layer, X-Slot Via Design, 1017 Thin Prepreg
Application：Mini LED (P0.58) Structure：10L HDI Thickness：47 mil Line width / Space：2.0 / 2.0 mil Min. Aperture：3.0 mil Laser Via Surface Treatment：ENIG Technological Feature：2+6+2, 4mil PAD gap 2.4mil
Application：Camera Module Structure：12L HDI Thickness：55 mil Line width / Space：3.0 / 3.0 mil Min. Aperture：3.0 mil Laser Via Surface Treatment：ENIG Technological Feature：8-stage Blind & Buried Hole, Pressing 9 times(8+4+8 Stack-up), Copper Paste Plugged Via
Application：77G Millimeter Wave Radar Structure：8L HDI Thickness：63 mil Line width / Space：3.5 / 5.9 mil Min. Aperture：5.9 mil Laser Via Surface Treatment：OSP Technological Feature：Line width tolerance ±0.6mil, Antennqa EA≤0.6mil, with copper step depth control Copper thickness in antenna area is 1±0.2mil and other areas is 1.8±0.2mil
Application：Switch Structure： 20L MLB Thickness： 102 mil Line width / Space： 3.5 / 4.0 mil Min. Aperture： 9.8 mil Via Surface Treatment： OSP Technological Feature：Resin Plug Hole, POFV, N+N Stack-up
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