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Application：Switch (400G) Structure：28L MLB Thickness：146 mil Line width / Space：3.9 / 3.9 mil Min. Aperture：15.7 mil Via Surface Treatment：Gold Technological Feature：IT-988GSE, Back Drilling, POFV

Application：AI Accelerator Card Structure：18L Anylayer Thickness：62 mil Line width / Space：2.4 / 3.9 mil Min. Aperture：3.9 mil Laser Via Surface Treatment：Gold Plating Finger+ENIG Technological Feature：Any layer, X-Slot Via Design, Pressing 8 times, High alignment requirements

Application：Optical Module Structure：10L R-F Thickness：39.4 mil Line width / Space：3.9 / 6.3 mil Min. Aperture：Bilnd Via 4.7 mil, PTH 8.0 mil Surface Treatment：ENIG Technological Feature：HDI 2 Steps R-F, Gold Plating

Application：Automotive Ridar Structure：8L R-F Thickness：47.2 mil Line width / Space：3.9 / 3.9 mil Min. Aperture：9.8 mil Surface Treatment：ENIG Technological Feature：Impedance deisgn on both flexible and rigidable area, High precision ZIF finger in FPC area

Application：Display Module Structure：10L R-F Thickness：27.6 mil Line width / Space：3.0 / 3.4 mil Min. Aperture：Bilnd Via 3.9 mil, PTH 5.9 mil Surface Treatment：ENIG Technological Feature：HDI 2 Steps R-F

Application：Augmented Reality Glasses Structure：8L R-F Thickness：31.5 mil Line width / Space：4.8 / 2.5 mil Min. Aperture：Bilnd Via 3.9 mil, PTH 7.9 mil Surface Treatment：ENIG Technological Feature：HDI 2 Steps R-F, 4L FPC

Application：Smart Headphones Structure：10L R-F Thickness：31.5 mil Line width / Space：3.0 / 3.4 mil Min. Aperture：Bilnd Via 3.0 mil, PTH 21.7 mil Surface Treatment：ENIG Technological Feature：HDI 3 Steps R-F

Application：Sports Watch Structure：6L R-F Thickness：25.6 mil Line width / Space：3.0 / 3.0 mil Min. Aperture：Bilnd Via 3.0 mil, PTH 5.9 mil Surface Treatment：ENIG Technological Feature：HDI with Buried&Blind Via, Shielding flexible area connect with ground design impedance: 50Ω±10%

Application：Augmented Reality Glasses Structure：5L FPC Thickness：13.8 mil Line width / Space：3.0 / 2.6 mil Min. Aperture：3.9 mil Surface Treatment：Nickel-Silver Gold Technological Feature：Air Gap (20,000 flex cycles), Black Ink, Steel Stiffener, MIPI Impedance Control

Application：OLED Mobile Phone Structure：Double Layer Board Thickness：5.0 mil Line width / Space：2.0 / 1.9 mil Min. Aperture：3.0 mil Surface Treatment：Nickel-Silver Gold Technological Feature：Yellow Covering Film, Green Ink, Steel Stiffener, Fape, Two-Dimensional Code

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, China

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