R-F (Rigid-Flex)-Products-Huizhou CEE Technology lnc-R&D to sales and manufacturing

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R-F (Rigid-Flex)

Application: LCM Display Modules Structure: 10L R-F Thickness: 0.7 mm Line Width/Space: 0.075 / 0.087 mm Min. Hole Diameter: Bilnd vias-0.07mm Through holes: 0.1mm Surface Finish: ENIG Process Characteristics: 2steps Rigid-flex HDI Total Picth CPK>1.33

Application: Optical Modules Structure: 10L R-F Thickness: 1.0 mm Line Width/Space: 0.098 / 0.16 mm Min. Hole Diameter: Bilnd vias-0.12 mm Through holes: 0.20 mm Surface Finish: ENIG Process Characteristics: HDI 2steps R-F/Gold plating,ENIG+Gold plating

Application: Smart Headphones Structure: 10L R-F Thickness: 0.8mm Line Width/Space: 0.075 / 0.087 mm Min. Hole Diameter: Bilnd vias-0.076 mm Through holes: 0.55 mm Surface Finish: ENIG Process Characteristics: HDI 2steps R-F

Application: Automotive lidar Structure: 8L R-F Thickness: 1.2mm Line Width/Space: 0.1 / 0.1 mm Min. Hole Diameter: 0.25 mm Surface Finish: ENIG Process Characteristics: Impedance designs on both flexible and rigidable layer. High precision ZIF fingers in flexible area.

Application: Sports Watch Structure: 6L R-F Thickness: 0.65mm Line Width/Space: 0.075 / 0.075 mm Min. Hole Diameter: Bilnd vias-0.076 mm Through holes: 0.15 mm Surface Finish: ENIG Process Characteristics: HDI with Buried&blind via，Shielding flexible area connect with ground design impedance:50Ω±10%

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+86-752-5703333

sales@ceepcb.com

N0.1 Zhongjing Road, Chenjiang Street, HZZK Hi-tech industrial Development Zone, Huizhou city, Guangdong Province, china

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