HDI,FPC,R-F,MLB & HLC
Keywords:
Application：Automotive New Energy Battery Structure：Single Layer Board Thickness：6.3 mil Product Length：1.2 - 1.8 m Line width / Space：19.7 / 17.7 mil Min. Aperture：Non Through Hole Surface Treatment：Nickel-Silver Gold Technological Feature：Yellow Covering Film, FR4 Stiffener, Nickel Sheet, Tape
Keywords:
Application：Medical Equipment Structure：Hollowed -Out Single Layer Thickness：3.9 mil Hollow Finger Width：6.9 mil Surface Treatment：Tin Plating Technological Feature：Thin Fingers Hollowed Out On Both Sides, One Side of the Overhanging Design of the Three Areas of Copper Thickness Control Requirements of the Two Tin Thickness Control Requirements
Keywords:
Application：NEA Control Domain Structure：10L HDI Thickness：71 mil Line width / Space：3.9 / 3.99 mil Min. Aperture：3.9 mil Laser Via Surface Treatment：ENIG Technological Feature：2+6+2, ASIL-D Safety Class Requirement / High Reliability / Fine Line / Complete Impedance Control
Application：Smart Phone Structure：14L HDI Thickness：30 mil Line width / Space：1.6 / 2.0 mil Min. Aperture：3.0 mil Laser Via Surface Treatment：ENIG+OSP Technological Feature：Any layer, X-Slot Via Design, 1017 Thin Prepreg
Application：Mini LED (P0.58) Structure：10L HDI Thickness：47 mil Line width / Space：2.0 / 2.0 mil Min. Aperture：3.0 mil Laser Via Surface Treatment：ENIG Technological Feature：2+6+2, 4mil PAD gap 2.4mil
Application：77G Millimeter Wave Radar Structure：8L HDI Thickness：63 mil Line width / Space：3.5 / 5.9 mil Min. Aperture：5.9 mil Laser Via Surface Treatment：OSP Technological Feature：Line width tolerance ±0.6mil, Antennqa EA≤0.6mil, with copper step depth control Copper thickness in antenna area is 1±0.2mil and other areas is 1.8±0.2mil
Application：Supercomputer Server Structure： 24L MLB Thickness： 118 mil Line width / Space： 2.9 / 3.0 mil Min. Aperture： 7.9 mil Via Surface Treatment： ENIG Technological Feature：Resin Plug Hole, POFV, Twice Pressing, Blind and Buried Via
Application：HPC Structure： 18L MLB Thickness： 98 mil Line width / Space： 3.4 / 3.5 mil Min. Aperture： 7.9 mil Via Surface Treatment： OSP Technological Feature：TU883, Back drilling, POFV
Application：Server Structure： 20L MLB Thickness： 94 mil Line width / Space： 3.7 / 4.0 mil Min. Aperture： 7.9 mil Via Surface Treatment： ENIG Technological Feature：Back drilling, POFV
Application：GPU Riser Card Structure： 18L Anylayer Thickness： 86.6 mil Line width / Space： 3.5 / 3.0 mil Min. Aperture： 7.9 mil Via Surface Treatment： ENIG+GF Technological Feature：Segmented Golden Finger, Back drilling, Resin Plug Hole, POFV
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