HDI,FPC,R-F,MLB &amp; HLC

Resin-plug vias,POFV,2 times pressing with blind & buried vias

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Application: Switch Structure: 28L PCB Thickness: 3.7 mm Line Width/Space: 0.100 / 0.100 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG Process Characteristics:IT-988GSE, Back Drilling+POFV

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Application: Server Structure: 20L PCB Thickness: 2.4mm Line Width/Space: 0.100 / 0.100 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG Process Characteristics: Back-drilling,POFV

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HLB & HLC

Application:HPC Structure: 18L PCB Thickness: 2.5mm Line Width/Space:0.086 / 0.089 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG Process Characteristics: TU883 Back-drilling,POFV

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Application: GPU Accelerator Card Structure: 16L PCB Thickness: 2.2 mm Line Width/Space: 0.089 / 0.076 mm Min. Hole Diameter: 0.2 mm Via Surface Finish: ENIG+Goldfinger Process Characteristics: Steps Goldfingers,Back-drilling,POFV,Resin-plug vias

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Application: Millimeter Wave Radar Structure: 8L HDI Thickness: 1.6 mm Line Width/Space: 0.090/0.15mm Min. Hole Diameter: 0.15 mm Laser Via Surface Finish: OSP Process Characteristics: 1step(un-symmetric),Antenna trace width tolerance±15μm，EA≤15μm； Stepped copper, copper thickness 25±5μm in antenna area, 45±5μm in other areas

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Application: Mini LED (P0.58) Structure: 10L HDI Thickness: 1.2 mm Line Width/Space: 0.050 / 0.050 mm Min. Hole Diameter: 0.076 mm Laser Via Surface Finish: ENIG Process Characteristics: 2+6+2，0.1mm PAD gap 60μm

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Application: NEA Control Domain Structure: 10L HDI Thickness: 1.8 mm Line Width/Space: 0.100 / 0.100 mm Min. Hole Diameter: 0.10 mm Laser Via Surface Finish: ENIG Process Characteristics:2+6+2, ASIL-D Safety Class Requirement / High Reliability / Fine Line / Complete Inpedance Cont

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Application: Smart Phone Structure: 14L HDI Thickness: 0.75mm Line Width/Space:0.040 / 0.050 mm Min. Hole Diameter: 0.076 mm Laser Via Surface Finish: ENIG+OSP Process Characteristics:Anylayer，X-hole design.1017 Thin PP

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Application: AI Accelerator Card Structure: 18L HDI Thickness: 1.57mm Line Width/Space: 0.060 / 0.100 mm Min. Hole Diameter:0.10 mm Laser Via Surface Finish: Gold plating finger+OSP Process Characteristics: Anylayer， X-hole design ，8times laminations，strict layer alignment

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